Find out all of the information about the BE Semiconductor Industries N.V. Product: epoxy die bonder Datacon 2200 evo hS. Contact a supplier or the parent company directly to get a quote or to find out a price or your closest point of sale. Datacon Evo 2200 2015 vintage 2015 Vintage Configuration: Integrated Dispensing- Epoxy Stamping option Automatic wafer and tool changer- changer 7 Pick & place tools and 5 eject tools Bond Heads- Standard bond head, 0-360 rotation, no Heated bond head. DATACON 2200 EVO Plus 二手半导体设备, 中古半導体装置, 二手半導體設備, quipement semi-conducteur, benutzte halbleiterausstattung $ 0.00.

Datacon 2200 Evo Manual Download

Datacon 2200 Evo Manual

DATACON 2200 evo

Macbook pro sm bus controller driver. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.

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DATACON 2200 evo plus

The Datacon 2200 evo^plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership.
Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities.

ESEC 2100 xP PLUS

The Die Bonder Esec 2100 xP^plus is the the 2^ndgeneration of the most flexible 300 mm high speed platform, capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.

FINEPLACER® femto 2

Automated sub-micron Die Bonder

The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment.

Depending on the requirements, the modular FINEPLACER® femto 2 can be individually configured and retrofitted at any time to support new applications and technologies. This makes the system a perfect tool and reliable companion as applications migrate from product development to production. It covers the entire workflow of inspection, characterization, packaging, final test and qualification in semiconductor, communications, medical and sensor technologies.

Highlights

Sub-micron placement accuracy*
Handles ultra small to very large components
Fully-automated operation and assembly process
Supports wafer/substrate sizes up to 12″ *
Supports bonding forces up to 500 N*
Highly flexible platform architecture
Small footprint and compact design
Long-term stability

* depending on configuration and application https://treefox.amebaownd.com/posts/19649084. Engineering thermodynamics 8th edition pdf.

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Datacon 2200 Evo Manual Transfer Switch

DATACON 2200 evo

The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.

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ESEC 2100 FC PLUS

Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology.

Simultaneous movement of chip and camera – no time wasted for image taking
Low vibrations – no time wasted for motion settling
Innovative parallel activity machine design with Phi-Y movement pick-and-place
Focused on strip based products
Load recipe from host and run on any machine
Full recipe transfer from machine to machine
Operator independent results ensured by auto calibration
Reliable and accurate flip chip process
Smart and safe wafer mapping

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DATACON 8800 FC QUANTUM SIGMA

The Datacon 8800 FC QUANTUM^sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership

Exceptional accuracy of ± 10µm @ 3 Sigma at highest speed
High productivity, highest yield
Operator-independent quality by fully automatic machine calibration
Capability to handle any flip chip size
No restriction on substrate type (lead frames, strips, panels, wafers)
Ready for ultra thin die handling
Field-proven, reliable machine concept and production process
Matching the requirements of IDMs and subcons (90% market share)
Unbeatable benchmark for flip chip assembly equipment

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FLIPJET FJ520-ULTRASONIC FLIPCHIP BONDER

The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform.

The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible.

The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. 12″).

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FINEPLACER^® femto 2

Automated Sub-micron Die Bonder

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.

This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.

FINEPLACER® femto has the best cost – performance ratio of its class in the market.

Highlights

Sub-micron placement accuracy*
Handles ultra small to very large components
Fully-automated operation and assembly process
Supports wafer/substrate sizes up to 12″ *
Supports bonding forces up to 500 N*
Highly flexible platform architecture
Small footprint and compact design
Long-term stability

* depending on configuration and application

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SET FC 150

FC150: The Most Flexible High Accuracy Die Bonder

with ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full

Datacon 2200 Evo Manual Download

Datacon 2200 Evo Manual

DATACON 2200 evo

DATACON 2200 evo plus

ESEC 2100 xP PLUS

FINEPLACER® femto 2

Automated sub-micron Die Bonder

Highlights

Datacon 2200 Evo Manual Transfer Switch

DATACON 2200 evo

The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.

Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products.

ESEC 2100 FC PLUS

Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology.

DATACON 8800 FC QUANTUM SIGMA

The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership

FLIPJET FJ520-ULTRASONIC FLIPCHIP BONDER

The Flipjet FJ520 is the latest evolution of the Hesse GmbH flipchip bonder platform.

The substantial experience of the Hesse GmbH in transducer development and ultrasonic technology, combined with the routine in building complex machines for fully automatic production has made this development possible.

The FJ520 is designed with the flexibility for a wide range of applications and the possible requirements of future products in mind (e.g. 12″).

FINEPLACER® femto 2

Automated Sub-micron Die Bonder

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.

FINEPLACER® femto has the best cost – performance ratio of its class in the market.

Highlights

SET FC 150

FC150: The Most Flexible High Accuracy Die Bonder

with ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full

The Datacon 8800 FC QUANTUM^sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership

FINEPLACER^® femto 2